Snapdragon 8 Gen 3 to arrive with two variants - TSMC 4nm and 3nm process (2024)

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Snapdragon 8 Gen 3 to arrive with two variants - TSMC 4nm and 3nm process (1)

Snapdragon 8 Gen 3 to arrive with two variants - TSMC 4nm and 3nm process (2)

Key Signals in Semiconductor

Deal
GlobalFoundries has won a USD 3.1 billion US government contract
GlobalFoundries secures a 10-year contract with the U.S. Department of Defense. They will provide advanced chips for defense and aerospace systems, enhancing technological capabilities and ensuring national security. Read More>>

Partnerships
MediaTek partners with Mouser for Global Embedded Processors and SoCs
MediaTek and Mouser Electronics to offer IoT SoCs and modules, enabling faster development of smart applications. This collaboration aims to enhance MediaTek’s global distribution network and provide design engineers with easier access to advanced semiconductor solutions.Read More>>
MediaTek joins forces with Newland EMEA
The company aims to enhance hardware performance, connectivity, and innovation in the AIDC industry. They seek to empower businesses with innovative scanning and connectivity solutions & emphasize efficiency and security.Read More>>

Centre Setup and Expansion
GlobalFoundries opens new hub facility in Penang
GlobalFoundries has inaugurated a new hub facility in Penang and Malaysia to oversee its global operations. They aim to enhance supply chain resilience and support semiconductor manufacturing innovation in the facility.Read More>>

Merger and Acquisition
Cadence to acquire Intrinsix Corporation from CEVA
Cadence Design Systems is acquiring Intrinsix Corporation to enhance its aerospace and defense industry expertise. The CEVA will focus on its core semiconductor IP and software for wireless communications, sensing, and edge AI technologies. Read More>>

Executive Movements
Intel appoints Gokul Subramaniam as Intel India President
Subramaniam will oversee engineering and design operations, with his 11 years of technical and business leadership experience. Read More>>
CEVA Inc. appoints Iri Trashanski as Chief Strategy Officer
Trashanski to drive global strategy corporate development and marketing. With his 20+ years of semiconductor industry expertise. Trashanski’s leadership spans respected companies to enhance CEVA’s future growth. Read More>>

New Product Development and Product Launch
Snapdragon 8 Gen 3 to arrive with two variants – TSMC 4nm and 3nm process
Qualcomm is set to launch the Snapdragon 8 Gen 3 at the Snapdragon Summit with two variants. Smartphones from various brands are expected to feature this powerful chipset and it will be intriguing to see the performance differences between the variants. Read More>>

Layoff
Intel cuts at least 14 jobs in US
Intel is cutting at least 140 jobs in the US, with 89 employees at its Folsom R&D campus and 51 in California. With an aim to reduce costs amid a challenging economic environment, this move is part of Intel’s ongoing cost reduction and efficiency efforts.Read More>>

Latest Industry Insights from Draup Braindesk

Introducing new Chips and Solutions

  • Arm Holdings plc is prioritizing the development of low-power System-on-Chip (SoC) solutions for mobile chipsets, primarily featuring Arm-based CPU cores, with plans to extend its expertise to applications in the automotive, Internet of Things (IoT), data center, aerospace, and government sectors. Additionally, Arm is offering a design technology co-optimization (DTCO) approach to facilitate a smoother process flow and enhance power efficiency, performance, area, and cost for Arm cores.
  • Arm Holdings plc is actively developing the New Arm Total Compute Solutions, featuring the new 5th Generation GPU architecture that is the foundation for upcoming generations of visual computing on Arm GPUs. This includes the introduction of the new Arm Immortalis-G720 GPU. These advancements are designed to provide a cutting-edge platform for mobile computing, delivering an exceptional premium solution for smartphones.
  • Arm Holdings plc’s primary focus is on developing Arm Neoverse Compute Subsystems (CSS). These CSS configurations are pre-integrated and validated, designed to streamline development, lower costs, and enhance time-to-market. Arm CSS significantly simplifies SoC (System-on-Chip) design complexity, resulting in savings equivalent to 80 engineering years in a single partner implementation.
  • Arm Holdings is prioritizing the development of an open-source GPU driver to simplify, expedite, and secure software creation on Arm. They are also concentrating on designing mobile chipsets with Arm-based CPU cores for companies interested in next-gen process technology, and they aim to accelerate mobile device silicon success through their New Arm Total Compute Solutions
  • Arm Holdings’ introduction of Arm Neoverse Compute Subsystems (CSS) enables the ecosystem to develop specialized silicon with reduced cost, lower risk, and faster time-to-market compared to discrete IP solutions. Service providers with rich expertise in these segments would find a better opportunity to serve Arm Holdings plc.

Snapdragon 8 Gen 3 to arrive with two variants - TSMC 4nm and 3nm process (3)

Snapdragon 8 Gen 3 to arrive with two variants - TSMC 4nm and 3nm process (4)

Braindesk Report Link

Key Funding Alert

Intel commits to investing USD 83.6 Billion in European Union
The company’s plans include research and development, manufacturing, and advanced packaging. While Intel has faced challenges in Germany, such as labor shortages and high energy costs, the German government has provided USD 10.4 billion in federal subsidies to support the semiconductor supply chain.Read More>>

Startup Spotlight

Company – Sero
Total Funding– USD 14.6 Mn
About: Sero is a home comfort, construction, and energy company that helps people live easier, cheaper, and lower-carbon lifestyles. Founded to fight the climate emergency, Sero believes the key to success is making sustainable choices progressive and straightforward.Read More>>

Latest Reports Published in Draup

Snapdragon 8 Gen 3 to arrive with two variants - TSMC 4nm and 3nm process (5)

Microchip Technology Account Intelligence Report
Microchip Technology’s focus on Al integration and robust security measures will enable smarter edge devices and safeguard data integrity in critical applications.Read More>>

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Use JD Reader Co-Pilot to leverage AI and have your talent demand queries answered

Snapdragon 8 Gen 3 to arrive with two variants - TSMC 4nm and 3nm process (6)

  • Harness the capabilities of AI to swiftly resolve your talent demand queries through the cutting-edge JD Reader Co-Pilot feature.
  • Introducing the ‘My Accounts’ filter in JD reader to enable you to find job postings from companies saved in the ‘My Accounts’ list.

View All Updates

Snapdragon 8 Gen 3 to arrive with two variants - TSMC 4nm and 3nm process (7)

Snapdragon 8 Gen 3 to arrive with two variants - TSMC 4nm and 3nm process (8)

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Snapdragon 8 Gen 3 to arrive with two variants - TSMC 4nm and 3nm process (2024)
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